Internship Printed Circuit Boards Material Characterization

Would you like to help shape the future of printed circuit board technologies in autonomous driving? Then join our team and contribute to the investigation and evaluation of new printed circuit board materials.

• During your assignment, you will focus on the higher demands on printed circuit board technologies, which lead to higher stress on materials and design elements.
• Additionally, you will conduct experiments using thermomechanical analysis (TMA) and dynamic mechanical analysis (DMA), analyze specimens by metallographic cross-sectioning and optical microscopy, and evaluate the experimental results using Microsoft software tools.
• Finally, you will statistically evaluate the results obtained from the experiments.

Function: Engineering
Experience Level: Associate