[EMN] Expert for High-Performance SoC BSP Integration (with Joining Bonus)
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Job Description
🎁Q4 JOINING BONUS
Join BGSV by 31 December 2026 and receive a Joining Bonus equivalent to 1 month gross salary, subject to program eligibility and terms & conditions.
About the Role
As an Expert for High-Performance SoC BSP Integration, you will play a key role in building and integrating the foundational software stack for next-generation high-performance System-on-Chip (SoC) and Chiplet platforms. You will work deep within BSP, POSIX/Linux/QNX environments, developing and optimizing kernel modules and device drivers, porting low-level software across platforms, and enabling reliable integration with high-speed interfaces such as PCIe and UCIe. With hands-on expertise spanning bootloaders, Linux kernel, device drivers, and SoC architecture, you will contribute to the performance, scalability, and technical excellence of Bosch’s Automotive Chiplet Systems (ACS) project.
Learn more about Bosch’s Automotive Chiplet technology: https://www.bosch-semiconductors.com/stories-and-events/chiplet-revolution/
Your main responsibilities
• You will develop advanced software modules and drivers specifically for the POSIX operating system (e.g. QNX).
• You will design and develop robust Linux kernel modules.
• You will port existing Linux drivers (kernel and user Space) to specific Linux distribution environment to ensure seamless integration and functionality.
• You will develop and contribute to multi-layer Continuous Integration (CI) environments.
Requirements
Function: Information Technology
Experience Level: Mid-Senior Level