TW_汽車電子封裝_Packaging Development Engineer (ASIC)

Bosch Group

full-time mid Taipei, Taipei, Taiwan

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Job Description

We are seeking a motivated, skilled, and curious Semiconductor Packaging Engineer to support the development of innovative, automotive-grade ASIC products. This role serves as a key bridge between internal cross-functional partners and external assembly/test suppliers (OSATs). The ideal candidate combines technical packaging expertise with strong supplier management skills, a collaborative mindset, and a passion for continuous learning.

In this role, you will define, develop, and qualify robust packaging solutions. Your core tasks include:

• Package Design & Process Development: Drive design, material selection, and optimize assembly processes in close collaboration with external suppliers and internal cross-functional teams.

• Design & Risk Assessment: Participate in design risk reviews and Failure Mode and Effects Analyses (FMEAs) to mitigate assembly risks.

• OSAT & Supplier Management: Manage OSAT partners to overview manufacturing and processes, track project timelines, and ensure effective quality control.

• NPI & Process Qualification: Monitor prototyping runs and formal qualifications. Ensuring adherence to automotive standards (e.g., AEC-Q100, Q006).

• Global Collaboration: Act as the technical interface to align packaging and assembly requirements with international design, test, and quality management teams.