Dir, Package Design Engineering at Renesas Electronics | Job-Scouts.com

Dir, Package Design Engineering

Renesas Electronics
full-time mid Taichung, Taiwan
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Job Description

Responsibilities:

• Lead the global Packaging Sustaining Engineering organization supporting high-volume semiconductor manufacturing across internal assembly sites and OSAT partners throughout Asia, ensuring manufacturing excellence, customer satisfaction, yield, quality, reliability, cost competitiveness, and strategic supplier management.
• Responsible for Japan Assembly Engineering (PAE1) and Malysia Assembly Engineering (PAE3) Groups. 
• Work with Package Development Group (NPI). Takeover qualified products from NPI for mass production.
• Work with Supply Chain Management (SCM). Address Capacity or Material supply issues to secure on time delivery.
• Work with OSATs and QA to address assembly related quality or customer RMA issues.
• Work with Procurement, SCM, and Package Development to define Renesas OSAT strategy.
• Do the industry benchmarking on substrate suppliers, material suppliers, equipment suppliers, and competitors. Do the literature survey and perform competitive analysis.
• Address PCN and PDN issues.
• Publish Weekly Assembly Engineering Statistics. Define action plans for yield improvement, cost reduction, cycle time reduction, and continuous improvement.   
 

Dimensions:

• Global responsibility across Asia
• Internal factories and multiple OSAT partners
• Executive ownership of HVM sustaining.
• Global customer support
• Lead geographically distributed engineering teams
• Own manufacturing excellence, supplier governance, cost reduction, and HVM sustaining
 

Principal Accountabilities:

• Lead Manufacturing Sustaining Engineering for all released production packages.
• Own Customer RMA, failure analysis, RCA, CAPA and customer communications.
• Drive Yield Improvement and Process Excellence using SPC, DOE, PFMEA and analytics.
• Lead Cost Optimization through process, material and manufacturing improvements.
• Own Product Change Notification (PCN) planning, qualification and implementation.
• Lead Material Review Board (MRB) and disposition of abnormal materials/products.
• Manage OSAT suppliers, supplier audits, scorecards and technology alignment

Requirements

Function: Manufacturing
Experience Level: Director

Required Skills

Location

Taichung, Taiwan

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Dir, Package Design Engineering Renesas Electronics
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