Semiconductor Assembly Process Technology Development Engineer
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Job Description
You will be responsible for technology development tasks in the assembly and packaging of advanced semiconductor packages for AI, HPC (High Performance Computing), automotive, and IoT advanced semiconductor packages (such as Flip Chip Scale Package, Flip Chip Ball Grid Array, and Power Semiconductor Package).
• Development, equipment selection and implementation of assembly technologies for advanced packages such as VPS, FCOSP, and FCBGA
• Development and improvement of materials and processes for assembly processes (Molding, Ball mount, Marking, PKG saw)
• Support for Launching and Transitioning to Mass Production Lines
• Process quality and yield improvement activities
Reason for Hiring:
Our company is driving innovation in semiconductor packaging technologies, including Flip Chip, SiP, VPS, FCOSP, and FCBGA. As demand continues to grow in AI, HPC, automotive, and IoT applications, advanced packages with higher density, improved thermal performance, and greater reliability are becoming increasingly important.
To support the rapid expansion of these technologies, we are seeking experienced engineers in semiconductor assembly and packaging processes. In this role, you will contribute to the development of next-generation packages for AI/HPC, ADAS, and other advanced applications, from package design and process development to product launch. This is an excellent opportunity to work on cutting-edge semiconductor technologies and play a key role in shaping future innovations.
Requirements
Function: Engineering
Experience Level: Associate