Staff IC Package Design Engineer
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Job Description
1. Design IC semiconductor packages, including WLCSP, BGA, FCCSP, SiP, QFN/DFN, and leaded leadframe-based packages (SOP, T/M/V/SSOP, QFP, PDIP, SOT23), to meet manufacturing and reliability requirements.
2. Create package layouts using Cadence APD/SiP and AutoCAD in compliance with company standards and design rules.
3. Collaborate with cross-functional teams including Product Group, Package Development, Package Documentation, Package Simulation, IC Layout Design, Analog/RF/Digital Design, Assembly Engineering, Project Management and OSATs to ensure successful package execution.
4. Drive package design activities from concept and feasibility through production, providing technical solutions and resolving design challenges.
5. Optimize package designs to meet electrical, mechanical, thermal, and manufacturability requirements.
Requirements
Function: Manufacturing
Experience Level: Mid-Senior Level