Staff Package Design Engineer- experienced in package development of power SiP/module

Renesas Electronics

full-time lead Zhubei, , Taiwan · More jobs in Zhubei, Hsinchu County, Taiwan

This position is sourced from Renesas Electronics's career page . Apply through Job-Scouts to track your application status.

Sign Up to Apply

Job Description

See original posting for details.

Requirements

Function: Manufacturing
Experience Level: Mid-Senior Level

Location

Zhubei, , Taiwan

View on Google Maps

Similar open positions

Renesas Electronics

(Sr.) Staff Package Design Engineer - MIS substrate/FC expose die （ Experienced in Power or Gan is requried )

Zhubei, , Taiwan Work from Office

Renesas Electronics

(Sr.) Staff Package Design Engineer - MIS substrate/FC expose die （ Experienced in Power or Gan is requried )

Taipei, , Taiwan Work from Office

Renesas Electronics

(Sr.) Staff Package Design Engineer - MIS substrate/FC expose die （ Experienced in Power or Gan is requried )

Taichung, Taichung … Work from Office

Renesas Electronics

(Sr.) Staff Package Design Engineer - MIS substrate/FC expose die （ Experienced in Power or Gan is requried )

Shanghai, Shanghai,… Work from Office

Renesas Electronics

(Sr.) Staff Package Design Engineer - MIS substrate/FC expose die （ Experienced in Power or Gan is requried )

Suzhou, Jiangsu, Ch… Work from Office