Semiconductor Assembly Process Development Engineer

Our company actively drives technological innovation in semiconductor back-end processes, with a strong focus on next-generation packaging technologies such as Flip Chip and System-in-Package (SiP).

In rapidly growing fields—including AI, high-performance computing (HPC), automotive, and IoT—there is increasing demand for packaging solutions with higher density, enhanced reliability, and superior thermal performance. In response, we are accelerating the development of advanced technologies such as FCCSP (Flip Chip Chip Scale Package) and FCBGA (Flip Chip Ball Grid Array).

As device architectures become more complex and multifunctional, expanding our technological capabilities and strengthening our development organization are essential. To support this growth, we are seeking engineers with expertise in semiconductor back-end processes.

This role offers the opportunity to work at the forefront of innovation—developing high-density, high-heat-dissipation packages for AI/HPC, as well as high-reliability solutions for automotive and IoT applications—and to contribute to technologies that underpin transformative advancements such as AI and autonomous driving.

You will be responsible for technology development in semiconductor back-end processes, including assembly, packaging, and testing:

• Development and evaluation of advanced packaging technologies, including FCCSP and FCBGA
• Material and process development, as well as improvement of assembly processes (e.g., molding, strip grinding, ball mounting, marking, and package sawing)
• Support for production line setup and transition to mass production
• Driving process quality improvements and yield enhancement activities

Function: Manufacturing
Experience Level: Mid-Senior Level