Principal Power Module Design Engineer at Renesas Electronics | Job-Scouts.com

Principal Power Module Design Engineer

Renesas Electronics
full-time lead Taipei, Taiwan
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Job Description

We are seeking a Senior Power Module Design Engineer to own the end-to-end electrical design of high-density power modules. These products target next-generation GPU and AI accelerator core power delivery with extremely high current density, fast transient response, and tight thermal and reliability margins. This is a hands-on design role with full ownership from architecture definition through module validation.

Key Responsibilities

• Design high-current, high-density power modules for CPU/GPU/xPU core power and AI server power delivery applications.
• Collaborate with package engineers and IC designers to develop advanced packaging solutions that integrate ICs, inductors, and capacitors into a high-density module.
• Conduct PDN extraction for the module package to assess power path losses and switch-node ringing.
• Design inductors per module and silicon pinmap. Work with inductor vendors to bring concept designs into real products.  
• Build and run module thermal models to ensure all components remain below maximum operating temperatures.
• Work with the validation team to debug power modules and perform bench characterization, including efficiency, thermal, and transient performance.
• Support design-for-manufacturing (DFM) and design-for-test (DFT) activities.

Requirements

Function: Engineering
Experience Level: Mid-Senior Level

Required Skills

Location

Taipei, Taiwan

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