Principal Package Design Engineering

Job Description

• Design and develop package and interconnect methods for Renesas’s packaging needs in the areas of Power SiP/modules, flip-chip LGA, multi-chip module with substrate or embedded die/capacitor and power device packaging. 
• Package technologies qualification for consumer & industrial power as well as automotive power applications.  
• Benchmark, select and qualify suitable materials, processes and assembly subcontractors (OSAT) or contract manufacturers (CM).  
• Work with OSAT/CM  to develop, run DOE to optimize processes and establish process spec. 
• Work with Product groups and Reliability team, qualify new packages and processes within required time frame. 
• Resolve all process integration issues by ensuring all window checks are done on critical process steps.  
• Establish production controls and monitor to ensure there is no room for quality incidents.  
• Ensure smooth transition into production & implement ramp up monitor.   
• Work with OSAT/CM  to monitor and resolve process issues early in the production stage  to ensure only parts with superior quality shipped to customer.  
• Develop and maintain technical expertise on advances and innovations in power SiP/modules, wafer level packaging & flip chip interconnects in LGA. 
• Participate in packaging roadmap development & focus on execution.  
• Address internal and external customer complains working with peers of Marketing, Product groups, Quality and Operations organization to satisfy growth in businesses. 
• Establish & maintain package design rules.   
Qualifications

• Doctorate/Masters / Bachelor’s Degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering.  

• 10-15 years of relevant experience in package development emphasizing power SiP/module, wafer level & flip-chip LGA packaging.  

• Strong understanding of power SiP/modules which has an substrate or embedded die/capacitor, assembly process knowledge, qualification methods, SPC and statistical analysis software. Knowledge of Cu FSM/BGBM technologies a plus.  

• Strong interpersonal and communication skills.  

• Strong analytical and presentation skills.

Function: Manufacturing
Experience Level: Mid-Senior Level