Staff Package Design Engineer - Substrate 封装设计专家（基板方向）

Renesas Electronics

full-time lead Suzhou, Jiangsu, China · More jobs in Suzhou, Jiangsu, China

This position is sourced from Renesas Electronics's career page . Apply through Job-Scouts to track your application status.

Sign Up to Apply

Job Description

See original posting for details.

Requirements

Function: Engineering
Experience Level: Mid-Senior Level

Location

Suzhou, Jiangsu, China

View on Google Maps

Similar open positions

Renesas Electronics

Staff Package Design Engineer - Substrate 封装设计专家（基板方向）

Shanghai, Shanghai,… Work from Office

Renesas Electronics

Staff Package Design Engineer - Cu FSM/BGBM/Bumping 封装设计专家

Suzhou, Jiangsu, Ch… Work from Office

Renesas Electronics

(Sr.) Staff Package Design Engineer - MIS substrate/FC expose die （ Experienced in Power or Gan is requried )

Suzhou, Jiangsu, Ch… Work from Office

Renesas Electronics

Staff Package Design Engineer - Cu FSM/BGBM/Bumping 封装设计专家

Shanghai, , China Work from Office

Renesas Electronics

Staff Package Design Engineer- experienced in package development of power SiP/module

Zhubei, , Taiwan Work from Office