Find Your Dream Job
47944 jobs found
アナログIP回路設計エンジニア
• 担当技術分野 CMOSアナログIP設計 (温度センサ、BGR, AMP,コンパレータ等) • 対象製品:SoC, MCU製品全般 • プロジェクト内容: • 温度センサをはじめとするアナログIPの開発と製品性能の差別化に貢献 • 回路設計から評価まで、アナログIP開発一連プロセスに携…
Sr Staff Analog Engineer
・Technical Domain CMOS Analog IP Design (Temp sensor, BGR, AMP, Comparator. etc) ・Target Products SoC and MCU products ・Project Overview • …
MCU/SoC System Control Subsystem Development Engineer
• Develop System Control Subsystems (SYSSS) for microcontrollers (MCUs) and SoCs. • Develop system control functions that govern overall chip operati…
マイコン/SoC向けシステム制御サブシステム開発エンジニア
• マイコン/SoC向けシステム制御サブシステム(SYSSS)の開発 • リセット、クロック、低消費電力モード等、チップ全体の動作を支えるシステム制御機能の開発 • 新製品シリーズや新たな応用分野の要求に対応するための機能拡張・アーキテクチャ開発 • 仕様設計、アーキテクチャ設計、論理設計、機能検…
NPI Senior Process Engineer
To develop, optimize, qualify, and establish robust semiconductor assembly processes for semiconductor packages, covering multiple assembly processes…
NPI Senior Process Engineer
To develop, optimize, qualify, and establish robust semiconductor assembly processes for semiconductor packages, covering multiple assembly processes…
Engineer (Front Assembly Line)
To develop, optimize, qualify, and establish robust semiconductor assembly processes for semiconductor packages, covering multiple assembly processes…
NPI Senior Process Engineer
To develop, optimize, qualify, and establish robust semiconductor assembly processes for semiconductor packages, covering multiple assembly processes…
Engineer (Front Assembly Line)
To develop, optimize, qualify, and establish robust semiconductor assembly processes for semiconductor packages, covering multiple assembly processes…
Engineer (Front Assembly Line)
Job Summary • To develop, optimize, qualify, and establish robust semiconductor assembly processes for semiconductor packages, covering multiple ass…
NPI Senior Process Engineer
To develop, optimize, qualify, and establish robust semiconductor assembly processes for semiconductor packages, covering Molding, IR Reflow & Platin…
Engineer (Middle Assembly Line)
To develop, optimize, qualify, and establish robust semiconductor assembly processes for semiconductor packages, covering Molding, IR Reflow & Platin…